Zhen Ding Technology's (TPE:4958) subsidiary, Leading Interconnect Semiconductor Technology (Shenzhen), is looking to invest at least 12 billion yuan to build an advanced packaging substrate base, according to a Thursday filing with the Taiwan Exchange.
The project will serve as land for the unit's production and operations, with the land premium for the parcel to be acquire through bidding which isn't expected to cross 200 million yuan.