Asia
CanSemi Technology Files Prospectus for Shenzhen IPO
Wafer manufacturer CanSemi Technology (SHE:301660) on Tuesday filed a prospectus for an initial public offering of 512.6 million shares, or about 17.81% of total share capital, on Shenzhen's ChiNext board.Proceeds will be used for capacity expansion and technological upgrading, according to the prospectus.Expected listing date is Sept. 24.GF Securities serves as lead underwriter, with Guotai Haitong Securities serving as joint lead underwriter.
SHE:301660
