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X-chip Semiconductor's IPO Strategic Placement Tranche Raises 289 Million Yuan

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Jiangsu X-chip Semiconductor Technology (SHE:301707) disclosed preliminary allocations for its ChiNext IPO in Shenzhen, with its strategic placement tranche raising 289.3 million yuan from the issue of 12.34 million shares.

The chip packaging and testing company priced its offering of 41.1 million shares at 23.45 yuan apiece, raising 964.3 million yuan in gross proceeds.

Strategic investors include China Shipbuilding Group Investment, China Electronics Technology Investment, China Ordnance Investment Management, Shenzhen High-Tech Venture Capital and Qingdao Chengjin Emerging Industry Investment Fund Partnership.

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