United Microelectronics (TPE:2303) has received board approval to raise up to $1.8 billion through the issue of unsecured overseas convertible bonds, according to a Wednesday filing to the Taiwan stock exchange.
The semiconductor foundry will issue bonds of $200,000 each in two tranches with a tentative tenor of up to five years.
The issue price has been tentatively set at 100% of face value at a tentative coupon rate of 0%.
Oversea-Chinese Banking Corp. or OCBC (SGX:O39), filed for the listing of 1 billion pounds floating rate covered bonds due 2029 on the Singapore bourse, according to a filing with the Singapore Exchange on Wednesday.The bonds will be listed and quoted on the Bonds Market on Aug. 20, the filing said.
DBS (SGX:D05) unit, DBS Bank, filed for the listing of EUR2 billion 3.239% covered bonds due 2031 on the Singapore bourse, according to a filing with the Singapore Exchange on Wednesday.The bonds will be listed and quoted on the Bonds Market on Aug. 27, the filing said.
CGN Power (SHE:003816, HKG:1816) issued a total of 2 billion yuan of five-year medium-term bonds in two tranches with an interest rate of 1.7%, according to a Wednesday filing with the Shenzhen Stock Exchange.The bonds are set to mature Aug. 25, 2031. The issuances represent the fifth and sixth tranches of the company's 2026 medium-term bond program.Bank of China serves as the bookkeeping manager and lead underwriter for the fifth tranche, while Industrial and Commercial Bank of China acted as lead underwriter.China Merchants Bank is the bookkeeping manager and lead underwriter of the sixth tranche, while Ping An Bank is also a lead underwriter.The company's shares jumped 6% in Hong Kong and 4% in Shenzhen during morning trading on Wednesday.