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JHT Design Plans to Issue 850 Million Yuan in Convertible Bonds

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Chinese semiconductor chip testing equipment manufacturer JHT Design (SHA:603061) plans to issue convertible bonds worth up to 850 million yuan, according to a Shanghai bourse filing on Wednesday.

Proceeds from the potential issuance will be used for several construction projects, such as the Shanghai Lanbo Semiconductor Equipment Manufacturing Center, a research and development semiconductor advanced equipment center and a manufacturing plant. The remaining proceeds of 130 million yuan will be used to supplement the company's working capital.

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