Innolux Targets Growth in FOPLP, Glass Substrate Packaging Market
Innolux (TPE:3481) is targeting growth in the fan-out panel-level packaging (FOPLP) and glass substrate packaging market, which is expected to reach $8 billion by 2030.The company is expanding into advanced semiconductor packaging, including through-glass-via (TGV) technology, leveraging its experience in large-size glass processing and panel-level manufacturing, according to a Tuesday press release.The company said it has developed glass substrates with strategic partners that address warping and heat-dissipation issues associated with traditional organic substrates under high thermal loads. Its non-display and commercial display businesses accounted for 55% of revenue in the first half of 2026 as it continues its shift toward an asset-light model.Innolux said it is working with global partners to develop its semiconductor packaging business.
