TSMC (TPE:2330) confirmed its plans to spend an additional $100 billion to expand its US chipmaking capacity, taking its total investment plan to $265 billion, in an email responding torequest for a comment on Thursday.
The additional funding will be used to build four chip plants, taking the company's US presence to 10 fabrication plants and two packaging facilities, the company said.
The pledge is part of a broader agreement between the US and Taiwan which lowered tariffs on the latter to 15% in exchange for $250 billion in direct US investment, the report noted.
The dual-listed semiconductor company intends to deploy additional funding towards building more semiconductor logic wafer fabs for 2-nanometer and below technologies, along with advanced packaging fabs in Arizona, according to Chairman and CEO Dr. C.C. Wei.
"The company is evaluating how to best deploy the new investment based on market condition and customer needs," according to the company's PR division.