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Update: Market Chatter: TSMC Developing AI Chip-Packaging Technology Similar to Intel's

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(Updates with TSMC's response to a request for comment.)

Taiwan Semiconductor Manufacturing (TSM), or TSMC, is developing advanced AI chip-packaging technology akin to what Intel (INTC) already offers, as it looks to better compete with a distant rival, The Information reported Thursday, citing two people with direct knowledge of the matter.

TSMC declined to comment to.

(Market Chatter news is derived from conversations with market professionals globally. This information is believed to be from reliable sources but may include rumor and speculation. Accuracy is not guaranteed.)

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