Taiwan Semiconductor Manufacturing (TPE:2330) and NASDAQ-listed ASML Holding have formed a collaborative industry initiative to drive the transition to larger‑format 12‑inch photomasks for EUV lithography.
In a joint statement on Tuesday, the two parties said they are targeting to establish a 12-inch mask pilot line by 2031, which will support full lithography system readiness for advanced node production by 2033.
The transition will increase fab productivity, lower chip-making costs, and remove stitching constraints.