Tongfu Microelectronics (SHE:002156) raised up to 4.21 billion yuan in net proceeds from the sale of 76.2 million shares to 18 investors through a private placement, according to a Saturday filing with the Shanghai/Shenzhen Stock Exchange.
The shares were sold at 55.38 yuan apiece and are due for listing on Sept. 16.
Net proceeds will help fund testing for memory chips, automotive and emerging applications, wafer-level packaging and testing, high-performance computing and communications, and working capital.