Shenzhen Techwinsemi Technology (SHE:001309) plans to apply for an additional credit or loan of up to 15 billion yuan for the year, according to a Shenzhen bourse filing on Friday.
This is on top of the other 15 billion yuan credit shareholders approved in March, bringing the threshold to up to 30 billion yuan.
The credit or loans will include bank acceptance bills, guarantees, letters of credit, collateralized loans and foreign exchange.
The Chinese chipmaker's shares slumped 5% during morning trade.