Southchip Semiconductor Technology (SHA:688484) plans to issue convertible bonds worth 1.59 billion yuan, according to a Wednesday filing on the Shanghai bourse.
The convertible bonds, which will be listed on Friday, July 10, will have a term of six years, maturing June 17, 2032.
CITIC Construction Investment Securities will be the lead underwriter of the issuance.
The chipmaker's shares at the close jumped 3%.