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FINWIRES

Soitec Raises EUR500 Million via Bond Placement

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French semiconductor materials company Soitec (SOI.PA) raised 500 million euros through a bond offering to qualified investors, the company said Friday.

The bonds, with a coupon of 0.5% per annum and due September 2033, will be settled in cash and/or convertible into new shares and/or exchangeable for existing shares of the company, according to a Friday release. The exchange price was set at 206.46 euros.

The concurrent accelerated bookbuilding is expected to be settled on Sept. 22, and the bonds will be issued on Sept. 25.

Soitec plans to use the net proceeds for general corporate purposes, including refinancing existing debt and investments to support organic growth.

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