Shenzhen Kaifa Technology (SHE:000021) subsidiary Shenzhen Payton will invest 1.85 billion yuan to expand high-end memory chip packaging and testing capacity, according to a Thursday filing with the Shenzhen bourse.
The project includes 1.22 billion yuan for a new factory capable of handling 90,000 wafers monthly of traditional packaging and 10,000 wafers monthly of 2.5D advanced packaging as well as 630 million yuan for a 2.5D/3DS advanced packaging research and development line.
Construction is slated for completion by December 2028. Pre-tax investment payback is about 12 years.
Shares of the hard disk components manufacturer rose 4% in recent trade.