Shanghai Fudan Microelectronics (HKG:1385, SHA:688385) agreed to form a joint venture in Shanghai to develop high-power aging test systems for semiconductor devices, according to a Monday Hong Kong bourse filing.
The company will contribute 17.5 million yuan in intangible assets for a 25% stake in the joint venture, which will have a registered capital of 70 million yuan.
The venture will develop, manufacture, and sell semiconductor testing equipment and related electronic measuring systems.