SENASIC Electronics Technology (HKG:6675) raised HK$912.5 million in net proceeds from its initial public offering in Hong Kong, according to a Tuesday after-market filing with the Hong Kong Exchange.
The Chinese wireless sensor system-on-chip provider priced its IPO at HK$18.36 per share, issuing 53.4 million shares in total.
The Hong Kong public offering portion of the deal was 5,144.97 times subscribed, with a final allocation of 5.34 million shares.
The international offering was 4.44 times subscribed, with 48.07 million shares allocated.
Cornerstone investors received 15.4 million shares, representing 28.86% of the IPO shares.
SENASIC Electronics is set to debut on the Hong Kong bourse today, June 17.