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Samsung Electronics, Broadcom Sign Deal to Expand AI Memory, Foundry Collaboration

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Samsung Electronics (KRX:005930) and US-based semiconductors and infrastructure software firm Broadcom signed a memorandum of understanding to expand their collaboration across memory and foundry technologies, the South Korean electronics products maker said in a Saturday release.

The collaboration is expected to support next-generation AI infrastructure. The partnership is expected to surpass $200 billion across the memory and foundry businesses over the next five years through 2030, the release said.

The partnership will see Samsung Electronics supplying high-bandwidth memory for Broadcom's next-generation AI accelerators and expanding foundry cooperation using the former's 2-nanometre and below process technologies. These would include advanced 2.3D and 2.5D packaging for AI and networking chips, it said.

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