Samsung Electronics (KRX:005930) broke ground on the Fläkt Group's heating, ventilation, and air conditioning (HVAC) production line at its Gwangju plant in South Jeolla Province, the company said in a Monday release.
Samsung will invest about ₩240 billion to build a 21,800‑square‑meter HVAC line at the plant's 3rd Campus, scheduled to be fully operational in early 2028, the release said.
Shares of the company added nearly 5% at market close.
SoftBank Group (TYO:9984) has launched $10 billion and 1 billion euros in senior unsecured notes to fund its investment in OpenAI, Reuters reported Monday, citing a term sheet.The dollar-denominated tranches mature in 3.5, 5.5, and 7.5 years, while the euro portions mature in four and six years, the newswire said.The proceeds will finance SoftBank's $10 billion payment for the third tranche of its OpenAI follow-on investment, expected to close on Oct. 1, while the remaining funds will be used for general corporate purposes, the report said.SoftBank Group did not immediately respond to' request for comment.(Market Chatter news is derived from conversations with market professionals globally. This information is believed to be from reliable sources but may include rumor and speculation. Accuracy is not guaranteed.)
Shenzhen Transsion (SHA:688036) said the Hong Kong Exchange is reviewing its application for listing on the Main Board.The listing is pending final approval from the Hong Kong bourse, the city's Securities and Futures Commission, and other regulators, according to a weekend filing with the Shanghai bourse.Shares of the mobile phone maker rose 4% in recent trade.
Shanghai Rural Commercial Bank (SHA:601825) received approval from China's National Financial Regulatory Administration to absorb Shanghai Chongming Rural Commercial Bank, according to a Saturday filing with the Shanghai bourse.The listed commercial bank will absorb Chongming RCB's assets, liabilities, institutions, businesses, employees, and other rights and obligations and will dissolve Chongming, according to the filing.