Mitsubishi Materials (TYO:5711) filed for the listing of 70 billion yen bonds on the Singapore bourse, according to a filing with the Singapore Exchange on Friday.
The company filed for the listing of 35 billion yen zero-coupon convertible bonds due 2032 and 35 billion yen zero-coupon convertible bonds due 2030.
The bonds will be listed and quoted on the Bonds Market on or about July 27, the filing said.