Nasdaq-listed Qualcomm considers marketing its data center products in China, developing chips that would be compliant with U.S. export controls, Nikkei Asia reported Thursday, citing the company's chief executive officer.
The statement came as the U.S. chipmaker vies to rival Nvidia with the launch of its Dragonfly data center chip lineup at the company's investor day in New York. Dragonfly's product lines comprise artificial intelligence accelerators, data center CPUs, custom silicon and connectivity chips, the report said.
CEO Cristiano Amon told Nikkei that Qualcomm is working to bring the Dragonfly lineup to China, with AI accelerators designed for the Chinese market that are compliant with U.S. export laws, according to the media outlet.
Amon said the data center processor's design, dubbed high bandwidth compute or HBC, will enable data center chips deliver six times the bandwidth per watt compared to high bandwidth memory or HBM chips, which are currently manufactured by South Korea's Samsung Electronics (KRX:005930) and SK Hynix (KRX:000660), Nikkei said.
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