Shenzhen Kaifa Technology (SHE:000021) subsidiaries Padien Technology Shenzhen and Hefei Padien Storage Technology will invest 1.47 billion yuan to expand high-end memory chip packaging and testing capacity.
Padien Technology Shenzhen will add 5 million wafer particles in packaging and 8 million chips in testing monthly, according to a Wednesday filing with the Shenzhen bourse.
Hefei Padien Storage Technology expects 28.8 million more wafer particles in packaging monthly.
The projects are set for completion by December 2027.
Shares of the electronics manufacturer closed 3% higher Wednesday.