Hwatsing Technology (SHA:688120) filed a revised plan to raise up to 3.80 billion yuan via a private placement of A-shares, according to a Monday filing with the Shanghai bourse.
The funds will finance the integrated circuit equipment research and development and manufacturing base, wafer reclaiming expansion, and high-end semiconductor equipment research and development projects.
The placement remains subject to Shanghai bourse review and registration with the China Securities Regulatory Commission.