-- Huaqin (HKG:3296, SHA:603296) completed the issuance of its 2026 second tranche of sci-tech innovation corporate bonds to professional investors, according to a Wednesday Hong Kong bourse filing.
Hong Kong-listed shares of the smart hardware products manufacturer were up nearly 1% in Thursday morning trade.
The company issued 1.2 billion yuan of three-year bonds at a coupon rate of 1.80%.