Grinm Advanced Materials (SHA:600206) will invest 486 million yuan to expand its high-purity sputtering targets facility for integrated circuits, according to a Friday filing with the Shanghai Stock Exchange.
The phase 2 expansion project will increase the capacity of high-purity copper and copper-alloy, tantalum, and titanium targets used in advanced semiconductor manufacturing by 30,000 units per year.
Construction will start in September 2026 and production will begin September 2027. Investment completion is slated for December 2028.