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Giantec Semiconductor Submits Application Proof for Hong Kong IPO

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Giantec Semiconductor (SHA:688123) submitted its secondary share offering application proof to the Hong Kong Exchange on Tuesday, according to a Wednesday disclosure to the Shanghai bourse.

The semiconductor firm plans to use the proceeds from the proposed offering to advance its core memory chip and mixed-signal technologies, expand its supply chain infrastructure, strengthen international teams, enhance marketing, fund strategic acquisitions, and supplement general working capital.

Shares fell 7% during morning trading on Wednesday in Shanghai.

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ESR REIT's DPU Up 2.4% in H1

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