Hon Hai Precision Industry (TPE:2317), also known as Foxconn, together with Radiall and Thales, launched a semiconductor packaging joint venture, Tessalia Technology, in France, according to a statement on Monday.
The partners laid the foundation stone for the facility in Le Barp near Bordeaux during the Choose France 2026 Summit.
Tessalia will focus on outsourced semiconductor assembly and testing services, producing advanced packaging solutions for the aerospace, telecommunications, automotive, and medical sectors.
Production is expected to begin by the end of 2029.
The project could attract more than 250 million euros in investment by 2033 and employ about 800 people at full capacity, the statement said.