Chengdu Ultra Pure Applied Materials (SHE:301717) has scheduled an online investor roadshow on Thursday, July 30, for its initial public offering on the Shenzhen Stock Exchange's ChiNext board.
The semiconductor equipment maker plans to issue 25.5 million shares, accounting for a 25% stake in the company post-offering, according to a Shenzhen bourse filing on Wednesday.
The initial strategic placement offering consists of 7.7 million shares, or 30% of the total IPO size.
Huatai Securities is the lead underwriter of the IPO.