BIWIN Storage Technology (SHA:688525) resubmitted its application for a share offering on the Hong Kong Exchange, according to a Thursday bourse filing in Shanghai.
Huatai International is the sole sponsor of the offering, according to documents submitted Wednesday.
The chip manufacturer plans to use the proceeds from its planned offering to boost research and development, enhance sales and marketing and customer service operations, fund mergers and acquisitions, and for working capital.
BIWIN first submitted its application in October 2025.