BIWIN Storage Technology (SHA:688525) and subsidiary Guangdong Xincheng Hanqi Semiconductor Technology will expand their investment in a chip packaging and testing facility by 4.5 billion yuan, according to a Wednesday filing with the Shanghai bourse.
Of the amount, 4 billion yuan will go to fixed-asset investments, including buildings and structures, slated for construction before Dec. 31, 2029.
Shares in the chip company rose 3% during morning trading on Wednesday.