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ASE Technology to Issue Up to $1 Billion Bonds

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ASE Technology (TPE:3711) board approved the issuance of up to $1 billion in unsecured overseas convertible bonds.

The five-year bonds will be issued at par value and are expected to carry a 0% coupon rate, according to a Thursday Taiwan Exchange filing.

Proceeds will be used to subscribe to new shares issued by subsidiaries Advanced Semiconductor Engineering and Siliconware Precision Industries via planned capital increases.

DBS Bank, Goldman Sachs and HSBC will act as lead underwriters for the offering.

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