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Huaqin Completes 1.2 Billion Yuan Sci-Tech Bond Issuance

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-- Huaqin (HKG:3296, SHA:603296) completed the issuance of its 2026 second tranche of sci-tech innovation corporate bonds to professional investors, according to a Wednesday Hong Kong bourse filing.

Hong Kong-listed shares of the smart hardware products manufacturer were up nearly 1% in Thursday morning trade.

The company issued 1.2 billion yuan of three-year bonds at a coupon rate of 1.80%.

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